Intercon Solutions, an Illinois-based electronics recycling company, has designed and unveiled an expanded polystyrene densification system. The company says it uses a new reverse engineering process incorporating high-volume extruder technology to recycle the material.
Using the system, Intercon Solutions says it is able to compress polystyrene into ingots by processing the material through a crusher, multiple heat bands and an extruder. With the process, Intercon says it can put roughly 2,500 pounds of the ingots into a Gaylord container.
The company says the process does not emit any harmful emissions.
“We had to establish a method for recycling what the nation is using right now, and Styrofoam isn’t something consumers are going to stop using anytime soon,” says Brian Brundage, Intercon CEO.
Explore the March 2011 Issue
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